Staff Packaging Development Engineer
Job description
ABOUT THE POSITION:
Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.
RESPONSIBILITIES:
• Develop and integrate new semiconductor packaging technologies.
• Manage technical projects for packaging technology advancement.
• Serve as a lead expert in packaging assembly processes, especially SMT.
• Innovate in package design, processes, and materials for next-generation solutions.
• Offer technical guidance during development phases and address high-volume production challenges.
• Spearhead projects from concept through to qualification and production in collaboration with R&D.
• Support technical customer engagements and problem resolution.
• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.
• Collaborate with offshore assembly, substrate partners, and suppliers.
• Present project updates to executive management and contribute to patent creation.
Job requirements
• Bachelor’s degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred.
• 10+ years’ experience in packaging or semiconductor assembly.
• Strong leadership and project management skills in packaging and assembly tech.
• Expertise in package design and SMT process development.
• Experience with heterogeneous integration, SiP, and various packaging forms.
• Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc.
• Exceptional communication skills for idea sharing and presenting to large groups.
• Familiarity with high volume manufacturing, ideally in the cellular handset market.
• Solid problem-solving skills; Lean and/or Six Sigma certification is a plus.
• Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards.
What We Can Offer
Bonus
Healthcare Plan
Training
Competitive rate
VietnamWorks calculates your competitive rate based on your application information and compares it with other candidates for this job after you apply.
Competitive rate
VietnamWorks calculates your competitive rate based on your application information and compares it with other candidates for this job after you apply.
Job Information
30/08/2024
Experienced (non-manager)
Manufacturing > Research & Development
Semiconductor Packaging, SMT Process Expertise, Project Management, Package Design, Communication Skills
Electrical/Electronics
Any
10
Not shown
Job Locations
5th Floor, CIC Tower building, No. 2 Lane 219 Trung Kinh Street, Cau Giay District, Hanoi
5th Floor, CIC Tower - 219 Trung Kinh Street, Cau Giay District, Hanoi
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